2021/08/18 New epoxy adhesives cure at 60°C

新型環氧黏合劑可在 60°C 下固化

Panacol has developed a range of new one component epoxy adhesives that cure at very low temperatures. These new adhesives were developed specifically for electronics applications and adhere very well to substrates with low surface energy.
Panacol 開發了一系列新的單組分環氧黏合劑,可在極低的溫度下固化。這些新型黏合劑專為電子應用而開發,可很好地黏附在表面能較低的基材上。

With the adhesives Structalit® 5511, 5521 and 5531, a range of adhesives has been developed that exhibit a unique set of physical properties after reaching full cure. This permits optimizing the adhesive with various component geometries, substrates, and operating functions.  
使用 Structalit® 5511、5521 和 5531 黏合劑,開發了一系列黏合劑,在完全固化後表現出一組獨特的物理特性。這允許優化具有各種組件幾何形狀、基材和操作功能的黏合劑。

All three adhesives are single-component, epoxy resin-based adhesives and cure at just 60°C, making them particularly suitable for temperature-sensitive electronic components. Curing at higher temperatures will accelerate cure time and add additional strength to the bond. 
這三種粘合劑都是單組分環氧樹脂基黏合劑,僅在 60°C 下固化,因此特別適用於溫度敏感的電子元件。在較高溫度下固化將加快固化時間並增加黏合強度。

Structalit® 5511 features a particularly low ionic content and is therefore especially suitable for use in electronics. Combining a high Young's modulus with an elongation at break of more than 8%, it ensures high adhesion to many substrates with additional shock and vibration resistance.
Structalit® 5511 的離子含量特別低,因此特別適用於電子產品。結合高楊氏模量和超過 8% 的斷裂伸長率,它確保對許多基材的高附著力,並具有額外的抗衝擊和抗振性。

Structalit® 5521 is softer and more flexible after curing, allowing the adhesive to better compensate for stresses between substrates. Due to its very low modulus of elasticity, this adhesive is very well suited for potting or for the application of thicker adhesive layers.
Structalit® 5521 固化後更柔軟、更柔韌,使黏合劑能夠更好地補償基材之間的應力。由於其非常低的彈性模量,這種黏合劑非常適合灌封或應用較厚的黏合劑層。

As the third adhesive of the new epoxy technology, Structalit® 5531 has an extraordinary low coefficient of thermal expansion (CTE), yet is flexible enough to withstand drop and vibration tests. The incorporation of filler particles gives the adhesive extremely high resistance to mechanical and chemical influences.  
作為新環氧樹脂技術的第三種黏合劑,Structalit® 5531 具有極低的熱膨脹係數 (CTE),但其柔韌性足以承受跌落和振動測試。填料顆粒的加入使黏合劑對機械和化學影響具有極高的抵抗力。

These Structalit® adhesives from Panacol generate very high bond strength with materials typically used in the electronics industry. They can also adhere very well to LCP (liquid crystal polymer) and other high-tech plastics with low surface energy. All three adhesives possess high purity and low ion content which complies with international standards for electronic and microelectronic component assembly.
Panacol 的這些 Structalit® 粘合劑與電子工業中常用的材料產生非常高的黏合強度。它們還可以很好地黏附到 LCP(液晶聚合物)和其他具有低表面能的高科技塑料上。這三種黏合劑均具有高純度和低離子含量,符合電子和微電子元件組裝的國際標準。